Semiconductor device

Details Semiconductor device Semiconductor device

2007-07-25

2011-10-25

Mayo, III, William (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S775000, C361S792000, C257S500000

Reexamination Certificate

active

08045335

ABSTRACT:
A semiconductor device includes first and second assembled bodies (12A,12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.

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Machine Translation of JP 2001308263 A: Okochi, Semiconduvtor Switching Module and Semiconductor; Publication Date: Nov. 2, 2001.

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