Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-06-26
2011-12-13
Gurley, Lynne A. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S773000, C257S777000, C257S778000, C257S786000, C257SE21503, C257SE23015, C257SE23020, C257SE23021, C257SE23023
Reexamination Certificate
active
08076785
ABSTRACT:
A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
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Japanese Office Action dated Jan. 18, 2011, issued in corresponding Japanese Patent Application No. 2006-061759 (w/partial English translation).
Aiba Kazuyuki
Kumagaya Yoshikazu
Nakamura Kouichi
Nishimura Takao
Takashima Akira
Fujitsu Semiconductor Limited
Gurley Lynne A.
Li Meiya
Westerman Hattori Daniels & Adrian LLP
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