Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2010-12-15
2011-10-11
Ha, Nathan (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S690000, C257SE23124
Reexamination Certificate
active
08035222
ABSTRACT:
A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
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Iijima Tetsuo
Ishizaka Katsuo
Kanazawa Takuro
Kido Norio
Mishima Akira
Brundidge & Stanger, P.C.
Ha Nathan
Renesas Electronics Corporation
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