Semiconductor device

Details Semiconductor device Semiconductor device

1990-06-06

1991-06-04

Wimer, Michael C.

357 234, 357 65, 357 68, H01L 2910, H01L 2348

Patent

active

050218441

ABSTRACT:
A semiconductor device includes two leads spaced apart from each other on a semiconductor substrate, a plurality of first electrodes opposite the leads, a second electrode having a pad portion located between the two leads, and a linear portion between the first and second electrodes, connecting portions, each for connecting one of the first electrodes with one of the leads via an electrically insulating cross-opver, the connecting portions adjacent the pad portion being diagonal to the linear portion of the second electrode. Thus, the width of the first electrode opposite the pad portion is reduced without modifying the other pattern elements. As a result, integration density can be improved.

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