Semiconductor device

Details Semiconductor device Semiconductor device

2009-02-18

2011-12-06

Pizarro Crespo, Marcos D (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S110000, C438S111000, C438S113000, C438S127000, C438S068000, C438S118000

Reexamination Certificate

active

08071428

ABSTRACT:
A semiconductor device and method. One embodiment provides an encapsulation plate defining a first main surface and a second main surface opposite to the first main surface. The encapsulation plate includes multiple semiconductor chips. An electrically conductive layer is applied to the first and second main surface of the encapsulation plate at the same time.

REFERENCES:
patent: 4646057 (1987-02-01), Reynolds
patent: 5646067 (1997-07-01), Gaul
patent: 5897337 (1999-04-01), Kata et al.
patent: 6180881 (2001-01-01), Isaak
patent: 6486415 (2002-11-01), Jimarez et al.
patent: 6614104 (2003-09-01), Farnworth et al.
patent: 6822324 (2004-11-01), Tao et al.
patent: 6860004 (2005-03-01), Hirano et al.
patent: 6982487 (2006-01-01), Kim et al.
patent: 7018866 (2006-03-01), Sugaya et al.
patent: 7145228 (2006-12-01), Yean et al.
patent: 7173324 (2007-02-01), Lee et al.
patent: 7202107 (2007-04-01), Fuergut et al.
patent: 7563652 (2009-07-01), Yang et al.
patent: 2001/0010627 (2001-08-01), Akagawa
patent: 2003/0006494 (2003-01-01), Lee et al.
patent: 2004/0058472 (2004-03-01), Shim
patent: 2004/0160751 (2004-08-01), Inagaki et al.
patent: 2004/0178495 (2004-09-01), Yean et al.
patent: 2005/0287700 (2005-12-01), Huang
patent: 2006/0024861 (2006-02-01), Cordes et al.
patent: 2006/0087044 (2006-04-01), Goller
patent: 2006/0094156 (2006-05-01), Lai et al.
patent: 2006/0183269 (2006-08-01), Fuergut et al.
patent: 2006/0189124 (2006-08-01), Beer et al.
patent: 2006/0211233 (2006-09-01), Gan et al.
patent: 2007/0069389 (2007-03-01), Wollanke et al.
patent: 2008/0217167 (2008-09-01), Hanson et al.
patent: 248 907 (1987-08-01), None
patent: 693 15 451 (1993-08-01), None
patent: 695 21 954 (2001-08-01), None
patent: 102 23 203 (2004-04-01), None
patent: 10 2004 013 770 (2005-05-01), None
patent: 10 2005 043 557 (2006-09-01), None
M. Brunnbauer et al., Embedded Wafer Level Ball Grid Array (eWLB), 2006 Electronics Packaging Technology Conference, 2006, pp. 1-5.
Office Action mailed Nov. 22, 2010 in U.S. Appl. No. 11/772,539.

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