Semiconductor device

Details Semiconductor device Semiconductor device

2008-11-14

2011-10-11

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE23141, C257S738000, C257S777000, C438S107000

Reexamination Certificate

active

08035224

ABSTRACT:
A semiconductor package includes a semiconductor chip having an integrated circuit, a functional element electrically coupled with the integrated circuit, and an array of contact elements connected with the integrated circuit and the functional element. The functional element is configured to protect the integrated circuit from transient voltage.

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Brunnbauer et al., “Embedded Wafer Level Ball Grid Array (eWLB),” 2006 Electronics Packaging Technology Conference, Copyright 2006, 5 pages.
“Sanmina-Sci Manufacturers World's First Prototype Printed Circuit Board with 100 Percent Embedded ESD Protection,” Sanmina-Sci Press Release, San Jose, CA., Aug. 8, 2007, 3 pages.

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