Semiconductor device

Details Semiconductor device Semiconductor device

2005-12-09

2010-06-22

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S687000, C257S787000, C257S666000

Reexamination Certificate

active

07741708

ABSTRACT:
A semiconductor device having a plurality of semiconductor chips mounted on a lead frame (10) and required portions covered with seal portions in which: the plurality of semiconductor chips are divided into a first group of semiconductor chips (Dx to Dz) and a second group of semiconductor chips (Du to Dw and Thx to Thz); both groups of semiconductor chips are mounted on the lead frame (10) at a distance from each other; the seal portions are comprised of first and second resin-seal portions (41and42) which cover the first and second groups of semiconductor chips, respectively, along with required portions of the lead frame; both resin-seal portions are mechanically coupled with each other by coupling portions; and a group of read terminals respectively connected to circuits within the first resin-seal portion and circuits within the second resin-seal portion are led out through a gap between the first resin-seal portion (41) and the second resin-seal portion (42).

REFERENCES:
patent: 6373078 (2002-04-01), Yea
patent: 01238152 (1989-09-01), None
patent: 05299456 (1993-11-01), None
patent: 11031775 (1999-02-01), None
International Search Report for Application No. PCT/JP2005/022622.

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