Semiconductor device

Details Semiconductor device Semiconductor device

2006-07-05

2010-11-23

Tran, Tan N (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S690000, C257SE21499, C257SE23031

Reexamination Certificate

active

07838973

ABSTRACT:
A semi-conductor device (100) comprises an exposed leadframe (10) with a die pad (11) and a plurality of leads (12). The die pad (11) has a substantially flat bottom surface (14) and a top surface (15). A semi-conductor die (2) is attached to a die attachment portion (31) of the top surface (15). Downbonds (5) connect the die (2) to a downbond attachment portion (32). Standard bonds (4) connect the die (2) to the leads (12). A plastic package (6) encapsulates the die (2), the standard bonds (4) and the downbonds (5). The top surface of the die pad has portions located at different levels, and step-shaped transitions between two adjacent ones of such portions. At least one of such step-shaped transition (36) is located between the die (2) and the downbonds (5). It has been found that such step-shaped transition provides good protection against downbond failure.

REFERENCES:
patent: 6388311 (2002-05-01), Nakashima et al.
patent: 6455348 (2002-09-01), Yamaguchi
patent: 6545347 (2003-04-01), McClellan
patent: 6569755 (2003-05-01), Yamada et al.
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 6894382 (2005-05-01), Awad et al.
patent: 2003/0080396 (2003-05-01), Kaneda et al.

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