Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor
Reexamination Certificate
2009-02-10
2010-11-09
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Junction field effect transistor
C257S780000, C257SE29089
Reexamination Certificate
active
07829919
ABSTRACT:
A semiconductor device which can prevent peeling off of a gate electrode is provided. The semiconductor device has GaN buffer layer12formed on substrate11, undoped AlGaN layer13formed on this buffer layer12, drain electrode16and source electrode17formed separately on undoped AlGaN layer13, which form ohmic junctions with undoped AlGaN layer13. Between drain electrode16and source electrode17, insulating layer20which has opening19is formed, and metal film21is formed on a surface of insulating layer2. Gate electrode18which forms a Schottky barrier junction with undoped AlGaN layer13is formed in opening19, and gate electrode18adheres to metal film21.
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Japanese Office Action, 2008-092706, mail date Jun. 8, 2010 5 pages.
Kabushiki Kaisha Toshiba
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Potter Roy K
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