Semiconductor device

Details Semiconductor device Semiconductor device

2007-09-20

2010-11-02

Fulk, Steven J (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S787000, C257SE23101, C438S106000

Reexamination Certificate

active

07825498

ABSTRACT:
A semiconductor device according to the present invention includes an island provided on one surface of a resin substrate, an external terminal provided on the other surface of the substrate, a thermal pad provided on the other surface of the substrate in opposed relation to the island, a heat conduction portion extending through the substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner, and a solder resist portion provided on the other surface of the substrate and having a heat dissipation opening which defines a gap with respect to an outer periphery of the thermal pad and a terminal opening which exposes the external terminal.

REFERENCES:
patent: 6038137 (2000-03-01), Bhatt et al.
patent: 7126210 (2006-10-01), Chiu et al.
patent: 2003/0052420 (2003-03-01), Suzuki et al.
patent: 2003/0057534 (2003-03-01), Ho et al.
patent: 2004/0212051 (2004-10-01), Zhao et al.
patent: 2005/0186704 (2005-08-01), Yee et al.
patent: 11-154717 (1999-06-01), None
patent: 2001-181563 (2001-07-01), None
patent: 06-339596 (2005-06-01), None
patent: 6339596 (2006-12-01), None

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