Semiconductor device

Details Semiconductor device Semiconductor device

2009-11-23

2010-12-28

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S687000, C257S777000, C257S778000, C257SE21214

Reexamination Certificate

active

07859096

ABSTRACT:
The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.

REFERENCES:
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6766320 (2004-07-01), Wang et al.
patent: 6815746 (2004-11-01), Suzuki et al.
patent: 6946323 (2005-09-01), Heo
patent: 7205644 (2007-04-01), Kuo et al.
patent: 2002/0041025 (2002-04-01), Tomihara
patent: 2004/0065963 (2004-04-01), Karnezos
patent: 6177323 (1994-06-01), None
patent: 10223683 (1998-08-01), None

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4216207