Semiconductor device

Details Semiconductor device Semiconductor device

2007-02-05

2010-06-01

Jackson, Jr., Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257S720000, C257SE23102, C257SE23104

Reexamination Certificate

active

07728426

ABSTRACT:
A semiconductor device10includes a silicon substrate20having a first interconnection layer24, a second interconnection layer26, and grooves22provided at the second main surface20b. Mounted on the substrate20are one or more semiconductor chips30having chip external terminals32electrically connected to the first interconnection layer; and one or more peripheral chips40electrically connected to the first interconnection layer on the silicon substrate. By the provision of the grooves22, the heat radiating property is improved.

REFERENCES:
patent: 6768205 (2004-07-01), Taniguchi et al.
patent: 2002/0075106 (2002-06-01), Okubora et al.
patent: 2004/0159954 (2004-08-01), Hetzel et al.
patent: 2004/0183205 (2004-09-01), Yamaguchi
patent: 2004/0207075 (2004-10-01), Noguchi
patent: 2005/0199995 (2005-09-01), Nomoto et al.
patent: 11-186430 (1999-07-01), None
patent: 2001-094000 (2001-06-01), None
patent: 2001-168139 (2001-06-01), None

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