Semiconductor device

Details Semiconductor device Semiconductor device

2007-01-24

2010-06-01

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23070

Reexamination Certificate

active

07728421

ABSTRACT:
Plural via portions formed on a package substrate of a BGA include a first through-hole portion extended in the plane direction by an extension wiring connected to a land portion and a second through-hole portion that is arranged on the land portion serving as pad-on-via, whereby high-density wiring and multi-function of the BGA can be realized by using the package substrate having a two-layer wiring structure. Accordingly, cost for the package substrate can be reduced, and hence, cost for the BGA can be reduced, compared to a multi-layer wiring structure having four or six wiring layers.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5841192 (1998-11-01), Exposito
patent: 6137168 (2000-10-01), Kirkman
patent: 6476331 (2002-11-01), Kim et al.
patent: 6734545 (2004-05-01), Yamamura
patent: 6855626 (2005-02-01), Sato et al.
patent: 7109573 (2006-09-01), Nurminen
patent: 2004/0207067 (2004-10-01), Ma
patent: 2004/0238939 (2004-12-01), Wu
patent: 2005/0263873 (2005-12-01), Shoji
patent: 2002-368398 (2002-12-01), None

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