Semiconductor device

Details Semiconductor device Semiconductor device

2008-07-07

2010-02-02

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S718000, C257SE33075

Reexamination Certificate

active

07656026

ABSTRACT:
A semiconductor device, includes: a wiring substrate having a wiring pattern on a front surface thereof; a first semiconductor chip mounted on the front surface of the wiring substrate; a first heat radiator having a first recess housing the first semiconductor chip and making contact with the front surface of the wiring substrate and the first semiconductor chip directly or with a first insulation layer; a second heat radiator making contact with a rear surface of the wiring substrate directly or with a second insulation layer; and a first fixing member passing through the first heat radiator, the wiring substrate, and the second heat radiator, and pressing the first heat radiator and the second heat radiator to the wiring substrate.

REFERENCES:
patent: 6223815 (2001-05-01), Shibasaki
patent: 6703702 (2004-03-01), Inoue et al.
patent: 2000-164792 (2000-06-01), None
patent: 2002-124607 (2002-04-01), None
patent: 2003-115568 (2003-04-01), None

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