Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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Details

C257S209000, C257S665000, C257SE21529, C257SE21596, C257SE23150

Reexamination Certificate

active

07728406

ABSTRACT:
A semiconductor device of the present invention comprises: a substrate; a plurality of wiring layers formed over the substrate; a fuse formed in an uppermost one of the plurality of wiring layers; a first insulating film made up of a single film and formed on the uppermost wiring layer such that the first insulating film is in contact with a surface of the fuse; and a second insulating film formed on the first insulating film; wherein the second insulating film has an opening therein formed above a fuse region of the uppermost wiring layer such that only the first insulating film exists above the fuse region, the fuse region including the fuse and being irradiated with a laser beam when the fuse is blown.

REFERENCES:
patent: 6867441 (2005-03-01), Yang et al.
patent: 6927100 (2005-08-01), Ema
patent: 2003/0015798 (2003-01-01), Haruhana et al.
patent: 2003/0173597 (2003-09-01), Kamiya
patent: 2007/0018279 (2007-01-01), Lin et al.
patent: 2008/0081454 (2008-04-01), Sakoh
patent: 2008/0286964 (2008-11-01), Hotta et al.
patent: 8-321549 (1996-12-01), None
patent: 2002-134616 (2002-05-01), None
patent: 2006-73891 (2006-03-01), None

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