Semiconductor device

Details Semiconductor device Semiconductor device

2007-09-19

2010-11-23

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S678000, C257SE23169, C257SE23178

Reexamination Certificate

active

07838978

ABSTRACT:
A semiconductor device and method is disclosed. One embodiment provides a substrate and a first semiconductor chip applied over the substrate. A first electrically conductive layer is applied over the substrate and the first semiconductor chip. A first electrically insulating layer is applied over the first electrically conductive layer. A second electrically conductive layer is applied over the first electrically insulating layer.

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Chinese Office Action mailed Feb. 5, 2010.

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