Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-06-25
2010-12-07
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23031, C257S674000, C257S690000, C361S704000
Reexamination Certificate
active
07847390
ABSTRACT:
A semiconductor device includes: a semiconductor module case; a metal terminal externally extending from within the case; a semiconductor element disposed within the case and electrically connected to the metal terminal; and a printed wiring board having a wiring pattern formed on a surface thereof, the printed wiring board being connected to the semiconductor element through the metal terminal; wherein the external portion of the metal terminal includes a joining portion and a resilient portion, the joining portion being in surface contact with an external surface of the case, the resilient portion facing and being spaced from the joining portion; wherein the printed wiring board is inserted between the joining portion and the resilient portion; and wherein the wiring pattern on the printed wiring board is pressure-welded to the joining portion.
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Chu Chris
Mitsubishi Electric Corporation
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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