Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257SE23184

Reexamination Certificate

active

07659613

ABSTRACT:
A frame-shaped sidewall is provided on a metallic base plate surrounding a semiconductor element arranged on the metallic base plate, which is provided with a stepped surface positioned at lower level at a portion of the base plate than a main surface of the base plate. A first dielectric plate is arranged on one side of the semiconductor element and a first circuit pattern is formed on its surface, a second dielectric plate is arranged on another side of the semiconductor element and a second circuit pattern is formed on the first and the second dielectric plate. An insulator is mounted on the stepped surface of the base plate, which forms a part of the sidewall. Power supply portions are provided including a band-shaped conductor. An interconnection is provided which connects the band-shaped conductor to the circuit pattern.

REFERENCES:
patent: 7091594 (2006-08-01), Kim et al.
patent: 2004/0046247 (2004-03-01), Tower
patent: 4-373155 (1992-12-01), None
patent: 2004-247514 (2004-09-01), None

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