Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-02-23
2010-10-12
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S719000, C438S122000, C438S687000, C257S707000, C257S712000, C257S666000, C257S739000, C165S080200, C165S185000, C428S210000, C428S212000, C428S600000
Reexamination Certificate
active
07813133
ABSTRACT:
A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.
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“Taiwanese Office Action” with English Translation, dated Oct. 30, 2008.
Igawa Osamu
Iijima Makoto
Ueno Seiji
Fujitsu Patent Center
Fujitsu Semiconductor Limited
Gandhi Jayprakash N
Smith Courtney
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