Semiconductor device

Details Semiconductor device Semiconductor device

2008-10-10

2010-12-14

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE23141, C257S758000, C257S773000, C438S460000

Reexamination Certificate

active

07851926

ABSTRACT:
A semiconductor device includes first underlying lines in an underlying wiring layer electrically connected to and shaped like a first semiconductor region, second underlying lines in the underlying wiring layer electrically connected to and shaped like a second semiconductor region, a first intermediate line in an intermediate wiring layer electrically connected to the first underlying lines, the first intermediate line including finger regions shaped like the first underlying lines, a coupling section to electrically interconnect the finger regions, a second intermediate line in the intermediate wiring layer electrically connected to the second underlying lines, the second intermediate line including finger regions shaped like the second underlying lines, and a coupling section to electrically connect the finger regions, a first overlying line in an overlying wiring layer electrically connected to the first intermediate line, and a second overlying line in the overlying wiring layer electrically connected to the second intermediate line.

REFERENCES:
patent: 4949139 (1990-08-01), Korsh et al.
patent: 5583359 (1996-12-01), Ng et al.
patent: 5594272 (1997-01-01), Matsuki
patent: 5939766 (1999-08-01), Stolmeijer et al.
patent: 6473290 (2002-10-01), Mochida
patent: 6490020 (2002-12-01), Kung
patent: 6542351 (2003-04-01), Kwang
patent: 6653681 (2003-11-01), Appel
patent: 6819542 (2004-11-01), Tsai et al.
patent: 6870223 (2005-03-01), Kumagai et al.
patent: 7045418 (2006-05-01), Mitros et al.
patent: 7222531 (2007-05-01), Isogai et al.
patent: 7259956 (2007-08-01), Fong et al.
patent: 7471093 (2008-12-01), Arisaka
patent: 2004/0182153 (2004-09-01), Hamamoto
patent: 2005/0156201 (2005-07-01), Matsuda
patent: 2000-311953 (2000-11-01), None

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4162440