Semiconductor device

Details Semiconductor device Semiconductor device

2008-04-28

2009-06-30

Dang, Trung (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23078, C257SE23079

Reexamination Certificate

active

07554186

ABSTRACT:
A semiconductor device includes a first semiconductor package, a second semiconductor package. The first semiconductor package includes a first semiconductor package base having a first cavity formed therein, a first mount component mounted in the first cavity, and a first magnet disposed on the first semiconductor package base. The second semiconductor package includes a second semiconductor package base having a second cavity formed therein, a second mount component mounted in the second cavity, and a second magnet disposed on the second semiconductor package base so as to adsorb the first magnet. The first semiconductor package and the second semiconductor package are stacked by an adsorption of magnetic force between the first magnet and the second magnet.

REFERENCES:
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 7339275 (2008-03-01), Wang et al.
patent: 2008/0265367 (2008-10-01), Tan et al.
patent: 2002-151551 (2002-05-01), None

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