Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2004-05-27
2009-10-27
Fourson, George (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257S712000, C257S777000, C257SE25027, C257SE21614
Reexamination Certificate
active
07608918
ABSTRACT:
A semiconductor device is provided which comprises a heat-radiative support plate5; and first and second semiconductor elements1and2mounted and layered on support plate5for alternate switching of first and second semiconductor elements1and2. The arrangement of piling and securing first and second semiconductor elements1and2on support plate5improves integration degree of semiconductor elements1and2, and reduces the occupation area on support plate5. Alternate switching of first and second semiconductor elements1and2controls heat produced from first and second semiconductor elements1and2because one of first and second semiconductor elements1and2is turned on, while the other is turned off.
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European Search Report for EP04745370.9, dated Jul. 24, 2009.
Bachman & LaPointe P.C.
Fourson George
Sanken Electric Co. Ltd.
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