Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-05-21
2009-08-04
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE23082
Reexamination Certificate
active
07569929
ABSTRACT:
A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member.
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European Search Report dated Oct. 7, 2008 issued by European Patent Office for application No. 08156824.8-1235.
Mori Shogo
Tamura Shinobu
Toh Keiji
Yamauchi Shinobu
Ha Nathan W
Kabushiki Kaisha Toyota Jidoshokki
Locke Lord Bissell & Liddell LLP
Showa Denko K.K.
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