Semiconductor device

Details Semiconductor device Semiconductor device

2008-04-01

2009-08-25

Duverne, Jean F (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07578676

ABSTRACT:
A semiconductor device includes a first plate member having a circuit surface on which a circuit is provided, a second plate member having a circuit surface on which a circuit is provided, a plurality of first flat plates disposed on the circuit surface of the first plate member, a first communicating section disposed on the circuit surface of the first plate member, a plurality of second flat plates disposed on the circuit surface of the second plate member, and a second communicating section disposed on the circuit surface of the second plate member. The first plate member and the second plate member are arranged so that a surface of the first plate member opposite to the circuit surface faces a surface of the second plate member opposite to the circuit surface.

REFERENCES:
patent: 7173442 (2007-02-01), Treibergs et al.
patent: 7182606 (2007-02-01), Ishii et al.
patent: 7214887 (2007-05-01), Higashida et al.
patent: 7248036 (2007-07-01), Trobough et al.
“Jump from Research to Commercialization due to the Cost Reduction and the Micro-fabrication”, Nikkei Electronics article, Road to Mass-production, Section 2, Oct. 10, 2005, Submitting pp. 92 and 93 (with English translation only).

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