Semiconductor device

Details Semiconductor device Semiconductor device

2007-09-26

2009-06-30

Richards, N Drew (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S676000, C257S685000, C438S111000

Reexamination Certificate

active

07554183

ABSTRACT:
A semiconductor device having a plurality of semiconductor chips mounted on lead frames is miniaturized by reducing its planar size and thickness. By disposing a rear surface of a first island and a top surface of a second island so as to at least partially overlap each other, a first semiconductor chip on the first island and a second semiconductor chip on a rear surface of the second island are configured so as to overlap each other. Accordingly, a planar occupied area can be set smaller than planar areas of both of the chips. Moreover, thin metal wires to be connected to the second semiconductor chip are extended to a back side. Consequently, a thickness of a semiconductor device can also be reduced.

REFERENCES:
patent: 5148243 (1992-09-01), Merrick et al.
patent: 6458625 (2002-10-01), Akram
patent: 2002/0153599 (2002-10-01), Chang et al.
patent: 2005/0023441 (2005-02-01), Inoue et al.
patent: 2007-05569 (2007-01-01), None
patent: 2001-0099694 (2001-11-01), None
patent: 2002-0061444 (2002-07-01), None

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