Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2004-01-21
2009-02-17
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
Reexamination Certificate
active
07492038
ABSTRACT:
A semiconductor device according to the present invention comprises, on a first semiconductor chip, a first circuit element region in which a first electrode group is arranged along an outer periphery of the first semiconductor chip in such a manner as to surround a second semiconductor chip, a second electrode group is arranged along the outer periphery of the first semiconductor chip in such a manner as to surround the first electrode group, and the first semiconductor chip is surrounded by the first electrode group, and a second circuit element region which surrounds the first electrode group and is surrounded by the second electrode group.
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Chabata Daigo
Hiratsuka Shinji
Saeki Yoshihiro
Ha Nathan W
Oki Semiconductor Co., Ltd.
Studebaker Donald R.
Studebaker & Brackett PC
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