Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-01-17
2009-10-20
Hoang, Quoc D (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S758000, C257SE23068, C257SE23069
Reexamination Certificate
active
07605464
ABSTRACT:
A semiconductor device includes: a semiconductor substrate having an integrated circuit formed thereon and an electrode electrically coupled to the integrated circuit; a passivation film formed on a surface of the semiconductor substrate, the surface having the electrode formed thereon; a first metal layer formed so as to come into contact with the passivation film; a resin layer formed on the first metal layer; a wiring formed so as to be electrically coupled to the electrode and reach an upper surface of the resin layer; and a second metal layer formed so as to be in contact with the first metal layer and reach the upper surface of the resin layer.
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Harness & Dickey & Pierce P.L.C.
Hoang Quoc D
Seiko Epson Corporation
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