Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-06-12
2009-08-18
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23184
Reexamination Certificate
active
07576423
ABSTRACT:
A frame-shaped sidewall is provided on a metallic base plate surrounding a semiconductor element arranged on the metallic base plate, a first dielectric plate is arranged on one side of the semiconductor element and a first circuit pattern is formed on its surface, a second dielectric plate is arranged on another side of the semiconductor element and a second circuit pattern is formed and the first and the second dielectric plate. Power supply portions are provided on a part of the sidewall, through which a first or a second band-shaped conductors is penetrating. A relay post is provided on the dielectric plate. The first band-shaped conductor is connected to the circuit pattern by an interconnection via the relay post.
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patent: 7005720 (2006-02-01), Huang et al.
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patent: 7274094 (2007-09-01), Boon et al.
patent: 2003/0000737 (2003-01-01), Liu et al.
patent: 2003/0218240 (2003-11-01), Cho
patent: 2004/0046247 (2004-03-01), Tower
patent: 4-373155 (1992-12-01), None
patent: 2004-247514 (2004-09-01), None
Ha Nathan W
Kabushiki Kaisha Toshiba
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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