Semiconductor device

Details Semiconductor device Semiconductor device

2006-10-10

2008-11-04

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S736000, C257S738000, C257S778000

Reexamination Certificate

active

07446414

ABSTRACT:
A semiconductor device includes a semiconductor substrate, an electrode pad electrically connected to a circuit element formed on the semiconductor substrate, a connection wiring electrically connected to the electrode pad and extending on the semiconductor substrate, and a post electrode formed on the connection wiring. The semiconductor device further includes an adhesion film formed on the side surface of the post electrode, and a sealing layer that has light-shielding property and seals the surface of the adhesion film and the connection wiring.

REFERENCES:
patent: 2004/0089944 (2004-05-01), Watanabe
patent: 2004/0099955 (2004-05-01), Shizuno
patent: 2004/0130022 (2004-07-01), Shizuno
patent: 2004/0150104 (2004-08-01), Terui
patent: 2005/0189068 (2005-09-01), Suzuki et al.
patent: 2005/0230794 (2005-10-01), Shizuno
patent: 2007/0269665 (2007-11-01), Shimoohsako et al.
patent: 2001-135742 (2001-05-01), None
patent: 2003-060120 (2003-02-01), None

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