Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-04-03
2008-12-09
Quach, Tuan N. (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S774000, C257S781000, C257SE23151
Reexamination Certificate
active
07462937
ABSTRACT:
A semiconductor device includes: a semiconductor substrate; an insulation layer which is disposed on the semiconductor substrate and includes a groove formed on a second surface of the insulation layer, opposite from a first surface of the insulation layer facing the semiconductor substrate; and a conductive part disposed on the insulation layer; wherein the conductive part has a wiring part formed in a manner that the wiring part comes in contact with a bottom surface and a side surface of the groove.
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Harness & Dickey & Pierce P.L.C.
Quach Tuan N.
Seiko Epson Corporation
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