Semiconductor device

Details Semiconductor device Semiconductor device

1984-02-03

1988-01-05

Sikes, William L.

357 80, 357 84, H01L 2302, H01L 2312

Patent

active

047179481

ABSTRACT:
A semiconductor device includes an electronic component in a hollow portion provided between two packing members each comprising a laminated structure. A laminated structure has a metallic layer and an insulating layer. The laminated structure can further have a reinforcing layer. One end surface of the laminated structure is an insulating layer. The insulating layers of these laminated structures oppose each other with peripheral portions thereof hermetically connected, so that the hollow portion containing the electronic component is airtight. A metallic layer is formed of a metal such as aluminum or an alloy thereof, an insulating layer is formed of organic material and the like and a reinforcing layer is formed of a fiber, a thermosetting resin, a thermoplastic resin and the like. The electronic component contained in the hollow portion is positioned to avoid contact with the packing members. The electronic component is electrically connected to the exterior through lead wires interposed between the contact surfaces of the two packing members.

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"New Techniques in Encapsulation of Semiconductors with Plastics," International Microelectron, pp. 48-49, (1976), USA; Author: John Hull, Hull Corporation.
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