Semiconductor device

Details Semiconductor device Semiconductor device

2007-04-17

2008-10-07

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S701000

Reexamination Certificate

active

07432589

ABSTRACT:
The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.The semiconductor device of the present invention comprises a semiconductor element28having a pair of electrodes, a housing12having the recess14for accommodating the semiconductor element28, a first lead electrode18and the second lead electrode20which are exposed on the bottom of the recess14, an adhesive layer30for die bonding between the semiconductor element28and the first lead electrode18, and electrically conductive wires32for wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrode18and between the other electrode and the second lead electrode20, wherein the housing12has the wall26formed to extend across the bottom surface of the recess14so as to divide the surface of the first lead electrode18into a die bonding area22and a wire bonding area24, and the first lead electrode18has the notch36which is formed by cutting off a portion of an edge of the first lead electrode18and located at least just below the wall26, while the wall26and the bottom portion40of the housing12are connected to each other through the notch36.

REFERENCES:
patent: 5261157 (1993-11-01), Chang
patent: 5650593 (1997-07-01), McMillan et al.
patent: 6426565 (2002-07-01), Bhatt et al.
patent: 6856357 (2005-02-01), Stevenson
patent: 6861747 (2005-03-01), Miyazaki et al.
patent: 7045905 (2006-05-01), Nakashima
patent: 2005/0199884 (2005-09-01), Lee et al.
patent: 2005/0221537 (2005-10-01), Tomabechi et al.
patent: 2006/0170083 (2006-08-01), Kim et al.
patent: 2006/0175716 (2006-08-01), Nakashima
patent: 2008/0130935 (2008-06-01), Sato et al.
patent: 62-47156 (1987-03-01), None
patent: 10-294495 (1998-11-01), None
patent: 200533194 (2005-02-01), None
patent: 2006210909 (2006-08-01), None

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