Semiconductor device

Details Semiconductor device Semiconductor device

2005-07-19

2008-05-20

Ho, Tu-Tu V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S692000, C257S758000, C257SE23153, C257SE23145

Reexamination Certificate

active

07375423

ABSTRACT:
A semiconductor device includes a pad composed of plural wiring layers and a power supply ring to provide a power supply provided through the pad for the power supply to an internal circuit, and the pad for the power supply and the power supply ring are connected by vias provided respectively above and below the power supply ring. Consequently, even if the width of the pad is narrowed, the number of vias disposed to connect the pad for the power supply and the power supply ring can be at least doubled compared to the conventional one to increase the amount of a current which can be provided to the power supply ring, which makes it possible to provide the sufficient current from outside to the power supply ring even in the semiconductor device with the narrow-width pad.

REFERENCES:
patent: 2004/0075174 (2004-04-01), Tamaru et al.
patent: 2000-307063 (2000-11-01), None
Office Action dated Sep. 7, 2007, issued in corresponding Chinese Application No. 200510084958.4.

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