Semiconductor device

Details Semiconductor device Semiconductor device

2007-06-14

2008-07-29

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S692000, C257SE25013

Reexamination Certificate

active

07405472

ABSTRACT:
A semiconductor device, which is constituted in such a way that a pad portion of a logic chip is connected to an element region of a semiconductor chip with a bump bonding, is capable of achieving high speed operability of the elements, because delay of transmission of an electrical signal is suppressed. a logic chip is directly connected to a DRAM, therefore, it is possible to suppress an increase of load capacitance caused by interconnects, and securing a wide bus width by a multiple pin connection. As a result, it becomes possible to enhance performance of the semiconductor device upon suppressing delay of information transmission from the logic chip to the DRAM.

REFERENCES:
patent: 6335491 (2002-01-01), Alagaratnam et al.
patent: 6400008 (2002-06-01), Farnworth
patent: 6469370 (2002-10-01), Kawahara et al.
patent: 6671947 (2004-01-01), Bohr
patent: 2002/0036340 (2002-03-01), Matsuo et al.
patent: 2002/0074637 (2002-06-01), Mcfarland
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 2003/0127720 (2003-07-01), Fang
patent: 2000-012618 (2000-01-01), None

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3967846