Semiconductor device

Details Semiconductor device Semiconductor device

2007-03-01

2008-03-04

Gurley, Lynne (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S668000, C257S669000, C257S787000, C257S676000, C257S697000, C257SE23031, C257SE23004

Reexamination Certificate

active

07339259

ABSTRACT:
A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and portions of the leads positioned outside the semiconductor chip are connected with electrodes formed on the semiconductor chip through wires.

REFERENCES:
patent: 5726079 (1998-03-01), Johnson
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6410979 (2002-06-01), Abe
patent: 6483184 (2002-11-01), Murata
patent: 6642609 (2003-11-01), Minamio et al.
patent: 6781223 (2004-08-01), Mihara et al.
patent: 6927483 (2005-08-01), Lee et al.
patent: 2001-244399 (2001-09-01), None

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