Semiconductor device

Details Semiconductor device Semiconductor device

2008-04-22

2008-04-22

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S758000

Reexamination Certificate

active

11137697

ABSTRACT:
A semiconductor device comprises a semiconductor chip in which a circuit part provided in a center of the semiconductor chip is connected with power-supply lines and power-supply electrodes to supply power from an external power source to the circuit part. A substrate is provided for carrying the semiconductor chip thereon and provided so that first terminals in a region encircling the semiconductor chip are electrically connected to the power-supply electrodes. A first opening is formed on the power-supply line in a center of the circuit part. A second opening is formed on the power-supply line at a peripheral part of the circuit part. A conductor layer is electrically connected to second terminals in the region encircling the semiconductor chip on the substrate, and provided so that the power-supply line in the first opening and the power-supply line in the second opening are connected together.

REFERENCES:
patent: 5229639 (1993-07-01), Hansen et al.
patent: 6025616 (2000-02-01), Nguyen et al.
patent: 6890794 (2005-05-01), Rotem
patent: 7249336 (2007-07-01), Nagata et al.
patent: 64-89447 (1989-04-01), None
patent: 3-8360 (1991-01-01), None

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