Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Reexamination Certificate

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Details

C257S673000, C257S735000, C257SE23043, C257SE23046, C257SE23050, C438S123000

Reexamination Certificate

active

11653402

ABSTRACT:
A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper surface, and side faces which connect the upper and lower surfaces with each other; an electrically conductive tab sealed within the sealing body; tab suspending leads contiguous to the tab and partially exposed to the lower surface and the side faces of the sealing body; a semiconductor chip fixed to a lower surface of the tab; a plurality of electrically conductive leads, the electrically conductive leads each having an inner end portion positioned within the sealing body, an outer end portion exposed to the lower surface and a side face of the sealing body, and a projecting portion projecting into the sealing body from a side face of each of the electrically conductive leads; a projecting portion projecting from a side face of each of the tab suspending leads and positioned within the sealing body; and electrically conductive wires positioned within the sealing body and connecting electrodes formed on a lower surface of the semiconductor chip with the projecting portions of the electrically conductive leads and the tab suspending leads.

REFERENCES:
patent: 5936837 (1999-08-01), Scribner et al.
patent: 6909179 (2005-06-01), Tanaka et al.
patent: 2001/0015481 (2001-08-01), Miyaki et al.
patent: 2002-134676 (2002-05-01), None

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