Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-02-06
2007-02-06
Luu, Chuong Anh (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S666000, C257S281000, C257S183000
Reexamination Certificate
active
10972410
ABSTRACT:
A semiconductor device includes: a package; two semiconductor chip fixing parts located adjacently to each other in the package; and first and the second semiconductor chips, each of which is fixed on the semiconductor chip fixing part and has a field effect transistor formed therein. A gate lead G1, a source lead S1, and a drain lead D2are arranged from left to right on the first surface of the package and a drain lead D1, a source lead S2, and a gate lead G2are arranged from left to right on the second surface. A gap between the source lead S1and the drain lead D2is two times a gap between the gate lead G1and the source lead S1, and a gap between the drain lead D1and the source lead S2is two times a gap between the source lead S2and the gate lead G2.
REFERENCES:
patent: 6677669 (2004-01-01), Standing
patent: 2000-217416 (2000-08-01), None
Hata Toshiyuki
Kanazawa Takamitsu
Otani Takeshi
Luu Chuong Anh
Mattingly, Stanger, Malur & Brundidge, .P.C.
Renesas Technology Corp.
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