Semiconductor device

Details Semiconductor device Semiconductor device

2007-11-20

2007-11-20

Gurley, Lynne (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23103

Reexamination Certificate

active

11375134

ABSTRACT:
A semiconductor device having a wiring substrate, a semiconductor element mounted on the wiring substrate via a heat sink, a wire electrically connecting the wiring substrate and the semiconductor element, the wiring substrate having through holes each connected to the wire or the heat sink, and external electrodes formed on a back surface of the wiring substrate and connected to the through holes. An insulating layer is formed between the heat sink and the semiconductor element, and the heat sink is divided into at least two sections. Hence, the back surface of the semiconductor element maintains an electrically disconnected state irrespective of the potential of the heat sink, and the heat dissipation design is allowed greater flexibility. Thus, the external electrodes connected to the heat sink via the through holes are connected to the mounting substrate wirings having satisfactory heat dissipation efficiency, allowing the heat of the semiconductor element to escape efficiently.

REFERENCES:
patent: 2003/0124772 (2003-07-01), Wright
patent: 2004/0099933 (2004-05-01), Kimura
patent: 2006/0055029 (2006-03-01), Othieno et al.
patent: 2001-28410 (2001-01-01), None
patent: 2003007914 (2003-01-01), None

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