Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-11-13
2007-11-13
Crane, Sara (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000
Reexamination Certificate
active
10553466
ABSTRACT:
In the case where a first semiconductor chip100and a second semiconductor chip200are stacked, both the semiconductor chips100and200are connected using micro bumps, in which a circuit block in the first semiconductor chip and a circuit block in the second semiconductor chip are connected by the micro bumps, and the circuit block in the second semiconductor chip is also connected to the external electrode by the micro bumps through the first semiconductor chip. Further, micro bumps121, 221that connect circuit blocks101, 102, 103, 104and210of both the semiconductor chips100, 200and the micro bumps122, 222that connect the circuit block210in one chip200to an external electrode are arranged in different positions.
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Crane Sara
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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