Semiconductor device

Details Semiconductor device Semiconductor device

2007-07-24

2007-07-24

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S127000, C438S462000

Reexamination Certificate

active

11018250

ABSTRACT:
In order to provide a semiconductor device which makes it possible to mount a semiconductor element on the substrate of the semiconductor device main body at the correct position with a higher degree of accuracy, a semiconductor element2is mounted at a circuit forming surface of a semiconductor substrate1at the periphery of which pad electrodes5are provided and a specific area in the semiconductor device containing the semiconductor element2is sealed with resin. At the circuit forming surface of the semiconductor substrate1, reference lines3are formed in correspondence to the positions of at least three corners of the semiconductor element2to be mounted.

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