Semiconductor device

Details Semiconductor device Semiconductor device

2007-09-04

2007-09-04

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S521000, C156S291000, C156S295000, C156S578000

Reexamination Certificate

active

11181987

ABSTRACT:
A semiconductor device according to an embodiment of the present invention comprises a packaging substrate mounted with semiconductor chips; a heat dissipation metal plate having three or more sides and mounted with the packaging substrates; a frame provided along an external periphery of the heat dissipation metal plate and encircling the packaging substrates; an adhesive provided to between the heat dissipation metal plate and the frame to bond the heat dissipation metal plate and the frame together; and a sealing resin sealing the semiconductor chips and the packaging substrates within a box formed by the heat dissipation metal plate and the frame, wherein the volume of the adhesive at corners of the heat dissipation metal plate is smaller than that on the sides thereof.

REFERENCES:
patent: 4699575 (1987-10-01), Geisel et al.
patent: 4787332 (1988-11-01), Geisel et al.
patent: 4842162 (1989-06-01), Merkel
patent: 5625536 (1997-04-01), Soyano et al.
patent: 5920119 (1999-07-01), Tamba et al.
patent: 5979794 (1999-11-01), DeFillipi et al.
patent: 6017485 (2000-01-01), Enck et al.
patent: 6261703 (2001-07-01), Sasaki et al.
patent: 6521983 (2003-02-01), Yoshimatsu et al.
patent: 6563211 (2003-05-01), Fukada et al.
patent: 6774465 (2004-08-01), Lee et al.
patent: 6823915 (2004-11-01), Schwarzbauer
patent: 6995461 (2006-02-01), Soyano et al.
patent: 2003/0016502 (2003-01-01), Yamada et al.
patent: 2004/0174682 (2004-09-01), Lin et al.
patent: 2005/0242341 (2005-11-01), Knudson et al.
patent: 7-130916 (1995-05-01), None
patent: 8-162572 (1996-06-01), None
patent: 11-307658 (1999-11-01), None

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3803125