Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – With contact or metallization configuration to reduce...
Patent
1995-02-22
1996-12-03
Wojciechowicz, Edward
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
With contact or metallization configuration to reduce...
257618, 257773, 257776, 257786, 257909, H01L 2900
Patent
active
055811094
ABSTRACT:
A semiconductor device includes a semiconductor chip, an I/O-cell circuit having a transistor-array part. The semiconductor device further includes a first group of bonding pads and a second group of bonding pads. The first group of bonding pads is connected with the I/O-cell circuit and is formed in a first pad-forming area arranged along an outer side of the transistor-array part in the I/O-cell circuit. And the second group of bonding pads is connected with the I/O-cell circuit and is formed in a second pad-forming area along an inner side of the transistor-array part in the I/O-cell circuit.
REFERENCES:
patent: 5162893 (1992-11-01), Okano
patent: 5436485 (1995-07-01), Shikatani et al.
Hayashi Kuniyuki
Kitagawa Masaya
Tanizawa Tetsu
Fujitsu Limited
Wojciechowicz Edward
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