Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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75, 75, 75, 75, 75

Reexamination Certificate

active

11256273

ABSTRACT:
A wiring layer is provided on a semiconductor substrate and extends in a predetermined direction. An external connection electrode terminal is provided on the wiring layer through a plurality of column-shaped conductors. The column-shaped conductors are located under the external connection electrode terminal. A density of arrangement of the column-shaped conductors is varied according to a direction of extension of the wiring layer.

REFERENCES:
patent: 5739587 (1998-04-01), Sato
patent: 5923088 (1999-07-01), Shiue et al.
patent: 2003/0080421 (2003-05-01), Sawai et al.
patent: 2003/0122258 (2003-07-01), Bobba et al.
patent: 2003/0124768 (2003-07-01), Hsu
patent: 2000-195866 (2000-07-01), None
patent: 2002-16065 (2002-01-01), None
Office Action dated May 1, 2007 issued in corresponding Taiwan Application No. 94137336.

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