Semiconductor device

Details Semiconductor device Semiconductor device

2007-07-03

2007-07-03

Crane, Sara (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S678000, C257S778000, C257S780000, C257S728000, C257S730000

Reexamination Certificate

active

11043256

ABSTRACT:
By securing a fatigue life of a connection portion with a semiconductor package and a mount board, a semiconductor device having a high reliability is provided.The semiconductor device consists of a semiconductor element, a mount board in which said semiconductor element is mounted, and a support member in which said mount board is supported through a connection member, wherein the connection member consists of a first mount board connection portion with the mount board at a first side of the element in a direction along a main surface of the mount board in which the semiconductor element is mounted, and consists of a first support member connection portion with the support member at a second side in opposition to the first side through the semiconductor element.

REFERENCES:
patent: 6437990 (2002-08-01), Degani et al.
patent: 6627997 (2003-09-01), Eguchi et al.
patent: 08-181228 (1996-07-01), None
patent: 09-097855 (1997-04-01), None

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