1990-04-09
1990-11-13
Hille, Rolf
357 80, H01L 2330, H01L 2328, H01L 2314
Patent
active
049705750
ABSTRACT:
A substrate and semiconductor chips are connected by solder bumps and a vacant space around the solder bumps is coated with resin in such a degree that the tops of the semiconductor chips are not coated therewith. Epoxy resin or a resin having a smaller thermal expansion coefficient than the epoxy resin is used in the resin coating, and an inorganic material having a smaller thermal expansion coefficient than said resin is mixed therein.
REFERENCES:
patent: 3818279 (1974-06-01), Seeger, Jr. et al.
patent: 4190855 (1980-02-01), Inoue
patent: 4604644 (1986-08-01), Beckham et al.
Hachino Hiroaki
Kobayashi Fumiyuki
Nakano Fumio
Sawahata Mamoru
Soga Tasao
Clark S. V.
Hille Rolf
Hitachi , Ltd.
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