Semiconductor device

Details Semiconductor device Semiconductor device

2006-12-05

2006-12-05

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S666000

Reexamination Certificate

active

07145223

ABSTRACT:
The semiconductor device of this invention includes a first die pad down-set away from boundary portions between inner lead portions and outer lead portions; a first semiconductor chip mounted on the first die pad; a chip-shaped electronic component with a small thickness mounted on a second die pad formed by increasing the width of at least one of the inner lead portions; metal wires; leads each having an inner lead portion and an outer lead portion; and an encapsulation resin part for encapsulating the die pads, the semiconductor chip, the chip-shaped electronic component, the inner lead portions and the metal wires.

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