Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-08-15
2006-08-15
Geyer, Scott B. (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23169
Reexamination Certificate
active
07091591
ABSTRACT:
A semiconductor device formed by mutually connecting a first semiconductor chip with second and third semiconductor chips arranged side by side, with the active surface of the first chip faced to those of the second and third chip. Both the second and third semiconductor chips have functional elements on their active surface. The first semiconductor chip has, in its active surface, a wiring for connecting the second semiconductor chip and the third semiconductor chip, and a terminal for external connection on its surface opposite to its active surface.
REFERENCES:
patent: 5798567 (1998-08-01), Kelly et al.
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6239495 (2001-05-01), Sakui et al.
patent: 6351391 (2002-02-01), Beliveau et al.
patent: 6365975 (2002-04-01), DiStefano et al.
patent: 6392292 (2002-05-01), Morishita
patent: 6424034 (2002-07-01), Ahn et al.
patent: 6444576 (2002-09-01), Kong
patent: 05-160336 (1993-06-01), None
patent: 07-176684 (1995-07-01), None
patent: 2000-311982 (2000-11-01), None
Geyer Scott B.
Rabin & Berdo P.C.
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