Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-12-04
1997-04-29
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 522, 257787, 361719, 361823, H05K 720
Patent
active
056255365
ABSTRACT:
A semiconductor device is formed of an insulative case frame having a frame portion; a lead pin block having a base and a plurality of lead pins with inner leads formed in the base, the lead pin block being installed inside the frame portion; a base plate attached to the frame portion for covering a first opening; a circuit board bonded to an inner face of the base plate and having semiconductor chips thereon connected to ends of the inner leads; a gel resin sealant filling an inner space of the insulative case frame over the circuit board and the semiconductor chips; and an insulative cover plate placed on the insulative case frame for closing a second opening of the insulative case frame. A sealing agent is disposed between the lead pin block and the frame portion to seal a gap therebetween, and an air vent is formed in the base of the lead pin block to communicate between the inner space and atmosphere.
REFERENCES:
patent: 5012386 (1991-04-01), McShane
patent: 5067005 (1991-11-01), Michii
patent: 5173766 (1992-12-01), Long
patent: 5416358 (1995-05-01), Ochi
patent: 5467253 (1995-11-01), Heckman
Soyano Shin
Toba Susumu
Fuji Electric & Co., Ltd.
Tolin Gerald P.
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