Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials

Patent

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Details

257700, 257703, H01L 2306

Patent

active

059593539

ABSTRACT:
A semiconductor device includes a plastic substrate with a multilayer structure having electrically conductive lines and an embedded planar metal layer, a semiconductor chip having electrodes connected to respective lines by solder, and a sealing member of a synthetic resin adhering the semiconductor chip tightly to the plastic substrate.

REFERENCES:
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5500555 (1996-03-01), Ley

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